AMD responds to Intel XMP 3.0 with RAMP technology

AMD responds to Intel XMP 3.0 with RAMP technology

AMD's AM5 socket is expected to debut in the second half of 2022, along with the Zen 4-based AMD Ryzen 7000 'Raphael' CPUs built on TSMC's 5nm process. The socket will have 1,718 pins and is therefore referred to as LGA1718. The first motherboards based on it will be equipped with 600 series chipsets. Additionally, the company has recently launched its Ryzen 6000 'Rembrandt' APUs for the mobile market, and desktop versions of these APUs will also be made available for the AM5 at a later date.

Photo Credit: AMD AMD's transition from PGA to LGA is expected to decrease the incidence of pin contact injuries. The 1,718 fragile pins are more naturally protected by the LGA format, nested in the motherboard socket and kept covered until seconds before the CPU is installed. The motherboards with the AM5 socket will also be the first to support DDR5 memories, at least on the AMD front, as well as the new PCI Express 5.0 interface. Unfortunately, DDR5 RAM is quite expensive at the moment due to the lack of PMIC (Power Management Integrated Circuit), but the situation should improve over the past few months.

Photo Credit: Computer Base if (jQuery ("# ​​crm_srl-th_hardware_d_mh2_1"). is (": visible")) {console.log ("Edinet ADV adding zone: tag crm_srl-th_hardware_d_mh2_1 slot id: th_hardware_d_mh2 "); } Finally, as anticipated by the developers of the popular HWiNFO diagnostic program (and reported by ComputerBase colleagues), AMD will take advantage of a new technology called RAMP (Ryzen Accelerator Memory Profile), which is a sort of response to Intel XMP 3.0. It will therefore be predefined overclocking profiles that will be used by the higher-end modules to maximize the overall performance of the system. AMD RAMP will most likely be compatible with Intel XMP 3.0, but the technology can also be adopted exclusively by memory manufacturers, as has happened in the past with G.Skill and its A-XMP certified kits for Ryzen.