Future Chinese CPUs as powerful as AMD Zen 3
According to what was reported by EET-China, in a recent conference, Loongson, a Chinese company that deals with the design of CPUs, announced that it plans to commercialize a new 32-core processor, called 3D5000, which will basically combine two 3C5000 dies into a single piece of substrate, over the next few months, as well as transition to the 6000 generation, which should match the IPC (Instruction per cycle) performance of the AMD Zen 3 microarchitecture in the next few years.3C5000 is the first 16-core Loongson processor based on LoongArch architecture. More specifically, the 3C5000 CPU is based on LoongArch's LA464 64-bit superscalar cores, compatible with the MIPS ISA, but are also capable of executing exclusive code for LoongArch (where, of course, it gives its best). The chip features four generic ALUs and two 256-bit vector operations units. The operating frequency ranges from 2.0GHz to 2.2GHz for a raw computing power of 560GFLOP with a TDP of 130W.
Photo credit: Loongson
If Loongson can truly catch up on modern processors like the AMD Ryzen 5000 with its upcoming CPUs, it will definitely be a big step forward. For the moment, we just have to wait several more months to find out more. Maybe in a few years Loongson will be able to carve out a more important space within the panorama of the processor market, placing himself alongside names like AMD and Intel.
If you are interested, find more details about the LoongISA architecture in our previous dedicated article.
AMD Zen 4-based Ryzen 7000 series CPU spotted in the nude: delidded
AMD's new Zen 4-based Ryzen 7000 series CPU has fallen into the hands of an 'unnamed overclocker' and been instantly delidded. Check it out:
VIEW GALLERY - 3 IMAGES
TechPowerUP reported the image, noting that the 'person who shared this picture should most likely not have done so and as such, we won't be posting a link to the source'. The photo shows us the IHS that is pretty damn thick, but you've also got the two CCDs and the IOD soldered to it.
The two CCDs in question are part of a two-chiplet design: each chiplet packs up to 8 x Zen 4 CPU cores (16 cores in total for up to 16 cores and 32 threads in the flagship Zen 4 processor). The I/O die is also new, with an integrated RDNA 2 GPU, and made on TSMC's fresh 6nm process node.