AMD CEO, Lisa Su, along with other executives will fly to Taiwan between late September and early November to meet local partners, including Taiwan Semiconductor Manufactoring Co., better known as TSMC.
In particular, Su and his collaborators will talk about future plans, focusing on the production nodes N3 Plus and N2, which should be ordered soon, so as to be ready for future devices or devices intended to be launched in the short term. Recall that the foundry is expected to start volume production of chips on node N2 in the second half of 2025.
AMD is one of TSMC's largest customers, as the company has engaged in large-scale chip production volumes for its products using cutting-edge production techniques. Precisely for this reason, the Sunnyvale-based company must ensure that there is sufficient allocation at TSMC and priority access to the company's latest PDKs (Process Design Kits).
Photo Credit: TSMC In addition to production nodes, Lisa Su will also discuss advanced packaging with Ase Technology, SPIL and TSMC. Currently, AMD uses TSMC's 3D SoIC (System on Integrated Chips) platform, as well as CoWoS (chip on wafer on the substrate) packaging technology and Ase's fan-out embedded bridge (FO-EB) packaging method to some of its products.| ); } Among the other partners to which AMD will visit there will also be ASUS and Acer, two of the major PC manufacturers, ASMedia, which deals with the creation of chipsets for the American company, as well as Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology for the supply of Aijinomoto build up film (ABF).
Today, we also reported that AMD, awaiting the launch of its new Radeon RX 7000 graphics cards, has cut the price of its current RX 6000 line. Find all the details in our dedicated news.