The Ryzen 7000's built-in cooler shows what the CPUs will look like

The Ryzen 7000's built-in cooler shows what the CPUs will look like

AMD's Ryzen 7000s, expected to launch after the summer, will bring several new features through the Zen 4 architecture, starting with support for the latest PCI-E 5.0 and DDR5 standards, as well as higher operating frequencies for both it concerns the CPU that the overclocking of the RAM memories. The new processors will continue to make use of a multi-chiplet design and will include RDNA2 integrated graphics for the first time. Despite still a few months separating us from the possible launch, an unknown overclocker has already managed to get his hands on a specimen, "uncovering" it through a classic delid and posting a photo of the IHS.

The image released by TechPowerUp has already been deleted from the original source which probably did not intend to share it to the public, which is why neither the name of the user nor the links relating to the provenance have been reported. However, the IHS of the Ryzen 7000 shows what Lisa Su already showed at last month's Computex: the CPU makes use of two chiplets that can hold up to 8 Zen 4 cores, along with a die made at 6nm that includes the 'I / O located at the bottom, as can be seen from the impressions left by the thermal material.



Source: Techpowerup
Remaining at AMD, Sapphire has recently launched the new Radeon 6700, a reduced proposal of the RX 6700 XT of which however no mention was made by the Sunnyvale company. You can learn more about the news in our dedicated article.