Thermalright wants to solve the problems at the Alder Lake IHS

As we have told you on several occasions, Intel Alder Lake CPUs tend to bend when installed in the LGA1700 socket due to the excessive pressure applied by the coupling system. When this happens, the surface is no longer uniform in contact with the heatsink, creating space that causes a loss of cooling efficiency. Despite this, Intel has reassured users by stating that they are aware of the problem and that, even with IHS folded, the processor continues to perform within its intended specification. The company has also warned that any intervention on its CPUs in this regard may result in the loss of warranty.

But to the detriment of the warning, the impromptu solutions by modders in order to solve the problem are not miss. Igor's Lab, for example, managed to achieve a decrease of 5 ° C in temperature by replacing the 4 washers that secure the socket coupling to the motherboard PCB. The Australian overclocker Karta instead used 3D printing to create a special bracket to be replaced with the coupling system: the bracket applies less pressure on the IHS, preventing it from bending.



The bracket made by Thermalright for the LGA1700 socket
Still remaining in the Intel sphere, new rumors have recently emerged that the Santa Clara house is planning to launch a desktop version of the low-end Arc 310 GPU. You can learn more about the details in our article.