TSMC to increase production to 4nm and 5nm ahead of RDNA 3
According to a new Digitimes article, TSMC will increase its production capacity on N5 nodes by 25% this year to be able to meet the demand for chips from companies such as NVIDIA, AMD and MediaTek (which uses N5 for the Dimensity SoC). 8000/8100 and N4 for Dimensity 9000). Previously, the N5 node was largely employed by Apple for its SoCs for smartphones and PCs.Photo Credit: TSMC The N5 production process family not only includes N5, but also N5P (for more performance), N4, N4P, N4X and 4N (exclusive to NVIDIA and which will surely use Hopper GPU for its computes, but its use for Ada Lovelace should not be excluded). According to Digitimes, TSMC currently has a maximum capacity of 120,000 wafer starts per month (WSPM), while it is expected to increase that to 150,000 WSPM by Q3 2022, thanks to the installation of additional equipment.
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Finally, AMD is expected to launch its new Ryzen 7000 series and EPYC processors based on Zen 4, as well as the graphics cards of the Radeon RX 7000 range next fall, around the same time that the GeForce RTX 40 (Ada Lovelace) should also arrive. TSMC will have to work hard to ensure sufficient production to meet the demand of various companies.